✦ LIBER ✦
Thermo-compression bonding-new way to join metal to semiconductors
- Book ID
- 127126354
- Publisher
- American Chemical Society
- Year
- 1957
- Tongue
- English
- Weight
- 123 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0009-2347
No coin nor oath required. For personal study only.