✦ LIBER ✦
Thermal studies on pin grid array packages for high density LSI and VLSI logic circuits : L. Mali Mahalingam, James A. Andrews and James E. Drye. IEEE Trans. Components Hybrids Mfg Technol.Chmt-6 (3), 246 (September 1983)
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 136 KB
- Volume
- 24
- Category
- Article
- ISSN
- 0026-2714
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