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Thermal stresses in a flexible circular plate of variable rigidity

โœ Scribed by Ya. M. Grigorenko; N. N. Kryukov; T. G. Akhalaya

Publisher
Springer US
Year
1981
Tongue
English
Weight
247 KB
Volume
17
Category
Article
ISSN
1573-8582

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Elastic thermal stresses in a circular o
Elastic thermal stresses in a circular overlay/rigid substrate system
โœ Z.F. Yuan; H.M. Yin ๐Ÿ“‚ Article ๐Ÿ“… 2011 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 501 KB

When an overlay/substrate system is subjected to a temperature change, thermal stress is induced due to the difference of thermal expansion coefficients between the overlay and substrate. This paper studies elastic thermal stress distribution of a circular overlay bonded to a rigid substrate due to