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Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser

✍ Scribed by Jian Liu, 刘剑; Jian Lu, 陆建; Xiaowu Ni, 倪晓武; Gang Dai, 戴罡; Liang Zhang, 张梁


Book ID
115368937
Publisher
Optics InfoBase
Year
2010
Tongue
English
Weight
843 KB
Volume
8
Category
Article
ISSN
1671-7694

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