Thermal stress analysis of a multichip package design : Robert Darveaux, Iwona Turlik, Lih-Tyng Hwang and Arnold Reisman. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 663 (1989)

• Book ID: 103284169
• Publisher: Elsevier Science
• Year: 1990
• Tongue: English
• Weight: 116 KB
• Volume: 30
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(90)90341-j