𝔖 Bobbio Scriptorium
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Thermal stability of the silica-aminopropylsilane-polyimide interface

✍ Scribed by Linde, H. G. ;Gleason, R. T.

Book ID
105335353
Publisher
John Wiley and Sons
Year
1984
Weight
724 KB
Volume
22
Category
Article
ISSN
0360-6376

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## Abstract A series of hybrid materials incorporating imide‐modified silica (IM‐silica) network structures into a polyimide (PI) matrix were produced with a sol–gel technique from solution mixtures of poly(amic acid) and tetraethoxysilane (TEOS) containing alkoxysilane‐terminated amic acids with v