Thermal stability of tantalum nitride diffusion barriers for Cu metallization formed using plasma immersion ion implantation

✍ Scribed by Mukesh Kumar; Rajkumar; Dinesh Kumar; A.K. Paul

• Book ID: 104050369
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 389 KB
• Volume: 82
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2005.06.001