𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Thermal-shock resistance and nature of crack resistance of alumina material with a layer-granular structure

✍ Scribed by S. M. Barinov; D. A. Ivanov; G. A. Fomina; V. I. Chistyakov; G. V. Matsueva

Publisher
Springer US
Year
1986
Tongue
English
Weight
381 KB
Volume
27
Category
Article
ISSN
1573-9139

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Contact damage submitted to thermal shoc
Contact damage submitted to thermal shock: A method to evaluate and simulate thermal shock resistance of brittle materials
✍ F. Osterstock πŸ“‚ Article πŸ“… 1993 πŸ› Elsevier Science 🌐 English βš– 652 KB

A criterion for study of the thermal shock resistance of brittle materials is derived. It makes use of the stable extension stage of Vickers indentation cracks under the action of the thermal transient stress which appears during quenching. During this stage, the relative increase in crack length ca

A termination structure of 2.5kV IGBT wi
A termination structure of 2.5kV IGBT with field plate and semi-resistive (SIPOS) layer
✍ Hyoung-Woo Kim; Jin-Woo Moon; Sang-Koo Chung πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 161 KB

## Abstract A junction termination with a field plate combined with a semi‐resistive layer deposited on front oxide layer is proposed for the first time as a termination structure of a 2.5 kV IGBT which allows high forward blocking voltage. The voltage handling capability of the proposed structure