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Thermal properties of poly(neopentylmethacrylate) thin films deposited via solventless, radical initiated chemical vapor deposition

✍ Scribed by Bharamaiah Jeevendrakumar, Vijay Jain; Altemus, Bruce A.; Gildea, Adam J.; Bergkvist, Magnus

Book ID
123459544
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
689 KB
Volume
542
Category
Article
ISSN
0040-6090

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## Abstract Plasma‐enhanced (PE) CVD from α‐methylstyrene is a dry method for synthesizing directly patternable sacrificial materials for generating pores or air dielectric layers. Films deposited at low power excitation (40 W) decompose between 65 °C and 75 °C, leave minimal residue following a 40