Curing behavior and thermal properties o
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Yanfang Liu; Zhongjie Du; Chen Zhang; Congju Li; Hangquan Li
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Article
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2006
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John Wiley and Sons
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English
β 363 KB
π 2 views
## Abstract The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourierβtransform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC),