Thermal modelling of the chip for the REMS wind sensor

✍ Scribed by L. Kowalski; J. Ricart; V. Jiménez; M. Domínguez; L. Castañer

• Book ID: 102385126
• Publisher: John Wiley and Sons
• Year: 2009
• Tongue: English
• Weight: 481 KB
• Volume: 23
• Category: Article
• ISSN: 0894-3370
• DOI: 10.1002/jnm.738

✦ Synopsis

Abstract

The silicon chip designed and fabricated by Micro and Nano Technology Group from Universitat Politècnica de Catalunya, which has been delivered to the Rover Environment Monitoring Station project, is the basic sensing element of the wind sensor included on the meteorological station for the Mars rover. The purpose of this article is to describe a thermal modelling analysis of the sensor under the rarefied Martian environment and to assure the sensor ability for reliable wind speed and incidence angle measurements. Copyright © 2009 John Wiley & Sons, Ltd.