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Thermal microstresses in beryllium and other HCP materials

✍ Scribed by R. W. Armstrong; N. R. Borch

Book ID: 112900656
Publisher: The Minerals, Metals & Materials Society
Year: 1971
Tongue: English
Weight: 490 KB
Volume: 2
Category: Article
ISSN: 1543-1916
DOI: 10.1007/bf02814957

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