Improvement of the Adherence of Thermal
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S. Beyer; D. Klemm; M. Bobeth; W. Pompe; O. Trommer; P. Gawlitza
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Article
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2005
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John Wiley and Sons
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English
โ 365 KB
๐ 2 views
The improvement of the adherence of thermal barrier coatings on a copper material as used in rocket combustion chambers by introducing an additional Al or Ti reaction layer and by realizing an optimum surface roughness is presented. Boundary layer reactions of Al and Ti with the copper substrate hav