Thermal-mechanical enhanced high-performance silicone gels and elastomeric encapsulants in microelectronic packaging : C. P. Wong. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 270 (June 1995).

• Book ID: 108362338
• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 113 KB
• Volume: 37
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(97)87829-8