Thermal Management for Opto-electronics Packaging and Applications

✍ Scribed by Xiaobing Luo, Run Hu, Bin Xie

• Publisher: Wiley
• Year: 2024
• Tongue: English
• Leaves: 370
• Edition: 1
• Category: Library

✦ Synopsis

A systematic guide to the theory, applications, and design of thermal management for LED packaging

In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.

The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.

The book also includes:

• A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
• Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
• Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
• Complete treatments of hybrid thermal management in downhole devices

Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

✦ Table of Contents

Cover
Title Page
Copyright Page
Contents
List of Nomenclatures
About the Authors
Preface
Chapter 1 Introduction
1.1 Development History of Packaging
1.1.1 BGA
1.1.2 CSP
1.1.3 MCM
1.1.4 3D Packaging
1.2 Heat Generation in Opto-electronic Package
1.2.1 Heat Generation Due to Nonradiative Recombination
1.2.2 Heat Generation Due to Shockley–Read–Hall (SRH) Recombination
1.2.3 Heat Generation Due to Auger Recombination
1.2.4 Heat Generation Due to Surface Recombination
1.2.5 Heat Generation Due to Current Crowding and Overflow
1.2.6 Heat Generation Due to Light Absorption
1.3 Thermal Issues and Challenges
1.3.1 Thermal Management
1.3.2 Mechanical/Electrical Reliability
1.4 Organization Arrangement
References
Chapter 2 Thermal Conduction and Solutions
2.1 Concept of Thermal Conduction
2.2 Thermal Resistance
2.2.1 Basic Concept of Thermal Resistance
2.2.2 Thermal Contact Resistance
2.2.3 Thermal Spreading Resistance
2.2.4 Thermal Resistance Network
2.2.5 Transient Thermal Conduction and Thermal Impedance
2.3 High Thermal Conductivity Materials
2.3.1 Structure and Materials of Chip
2.3.1.1 Structures of Chip
2.3.1.2 Material of LED Chip
2.3.1.3 Sapphire
2.3.1.4 Silicon
2.3.1.5 Silicon Carbide
2.3.1.6 GaN
2.3.1.7 β-Ga2O3
2.3.2 Solder
2.3.3 Heat Spreader
2.3.3.1 Graphene
2.3.3.2 h-BN
2.3.4 Package Substrate Materials
2.3.5 Thermal Conductive Polymer Composite for Encapsulation
2.3.6 Coolants
2.4 Thermal Interface Materials
2.4.1 Categories of Thermal Interface Materials
2.4.1.1 Carbon–Polymer TIMs
2.4.1.2 Metal–Polymer TIMs
2.4.1.3 Ceramic–Polymer TIMs
2.4.2 Strategies for Enhancing TC of Thermal Interface Materials
2.4.2.1 Surface Treatment
2.4.2.2 Filler Hybridization
2.4.2.3 Orientation and Network Engineering
2.4.3 Models for Thermal Conductivity of Thermal Interface Materials
2.5 Heat Pipe and Vapor Chamber
2.5.1 Heat Pipe
2.5.2 Vapor Chamber
2.6 Phase-Change Materials (PCMs)
2.6.1 Categories and Applications of PCMs
2.6.2 Thermal Conductivity Enhancement of PCMs
2.7 Thermal Metamaterials
2.7.1 Concept of Thermal Metamaterials
2.7.2 Thermal Metamaterial Design
2.8 Chapter Summary
References
Chapter 3 Thermal Convection and Solutions
3.1 Basic Knowledge of Convection Heat Transfer
3.1.1 Basic Concepts of Convection Heat Transfer
3.1.2 Basic Theories of Convection Heat Transfer
3.1.2.1 Similar Theory of Convection Heat Transfer
3.1.2.2 Boundary Layer Theory of Convection Heat Transfer
3.1.3 Basic Calculation of Convection Heat Transfer
3.1.3.1 Forced Convection Heat Transfer of a Fluid Over an Object
3.1.3.2 Forced Convection Heat Transfer in the Duct
3.1.3.3 Natural Convection Heat Transfer of Vertical Plate
3.1.3.4 Pool Boiling Convection Heat Transfer
3.2 Air Cooling
3.2.1 Heat Sink Design and Optimization
3.2.2 Piezoelectric Fan Cooling
3.3 Liquid Cooling
3.3.1 Microchannel Liquid Cooling
3.3.2 Impingement Jet Liquid Cooling
3.3.3 Flow Boiling
3.3.4 Spray Cooling
3.3.5 Nanofluid
3.4 Chapter Summary
References
Chapter 4 Thermal Radiation and Solutions
4.1 Concept of Thermal Radiation
4.2 Atmospheric Transparent Window
4.3 Spectra-Regulation Thermal Radiation
4.3.1 Deep Q-Learning Network for Emissivity Spectral Regulation
4.3.2 Design and Optimization of Radiative Cooling Radiators Based on DQN
4.3.3 Colored Radiative Cooling
4.3.3.1 Color Display Characterization
4.3.3.2 Influence of Structural Parameters on Colored Radiative Cooler
4.4 Near-Field Thermal Radiation in Thermal Management
4.5 Chapter Summary
References
Chapter 5 Opto-Thermal Coupled Modeling
5.1 Opto-Thermal Modeling in Chips
5.1.1 Thermal Droop
5.1.2 Opto-Electro-Thermal Theory for LED
5.2 Opto-Thermal Modeling in Phosphor
5.2.1 Phosphor Heating Phenomenon
5.2.2 Phosphor Optical Model
5.2.3 Optical–Thermal Phosphor Model Considering Thermal Quenching
5.3 Opto-Thermal Modeling Applications in White LEDs
5.4 Chapter Summary
References
Chapter 6 Thermally Enhanced Thermal Interfacial Materials
6.1 Modeling of TIM
6.1.1 Model of Thermal Contact Resistance
6.1.1.1 Theoretical Background
6.1.1.2 Topographical Analysis
6.1.1.3 Mechanical Analysis
6.1.2 Experiment for the Measurement of Rc
6.1.2.1 Experimental Principles
6.1.2.2 Thermal and BLT Measurement
6.1.2.3 Sample Preparation
6.1.2.4 Error Analysis
6.1.3 Validation and Discussion
6.1.3.1 Comparison of Experimental Data with the Model
6.1.3.2 Influence of the Parameters on the Model Results
6.2 Thermal Conductivity Tunability of TIM
6.2.1 Thermal Conductivity Enhancement of BN-Composites Using Magnetic Field
6.2.1.1 Fabrication of the Composites
6.2.1.2 Characterization and Analysis
6.2.1.3 Thermal Properties of Composites
6.2.2 Thermal Conductivity Enhancement of BN-Composites Using Combined Mechanical and Magnetic Stimuli
6.2.2.1 Fabrication of the Composites
6.2.2.2 Characterization and Analysis
6.2.2.3 Thermal Properties of the Composites
6.2.2.4 Theoretical Analysis of Thermal Conductivity
6.2.3 Magnetic-Tuning TIMs for Local Heat Dissipation
6.2.3.1 Fabrication of the Composites
6.2.3.2 Evaluation for Thermal Performance of the Composites
6.2.3.3 Thermal Properties of the Composites
6.2.3.4 Finite-Element Analysis of Composites Loaded with Local Heat Source
6.2.4 Thermal Conductivity Enhancement of CFs-Composites Using Preset Magnetic Field
6.2.4.1 Fabrication of the Composites
6.2.4.2 Characterization and Analysis
6.2.4.3 Thermal and Mechanical Properties of Composites
6.2.5 Self-Assembly Design of TIMs for Hotspot Problem
6.2.5.1 Fabrication of the Composites
6.2.5.2 Characterization, Analysis, and Optimization
6.2.5.3 Thermal and Mechanical Properties of Composites
6.2.5.4 Experiment Section
6.3 Interfacial Thermal Transport Manipulation of TIM
6.3.1 Synthesis of Interface Systems
6.3.2 Measurement of Interfacial Thermal Conductance
6.3.3 Characterization of Interfacial Bonds
6.3.4 Importance of Covalent Bonds
6.3.5 Manipulation of the Thermal Properties of Nanocomposites
6.4 Chapter Summary
References
Chapter 7 Packaging-Inside Thermal Management for Quantum Dots-Converted LEDs
7.1 Thermally Conductive QDs Composite
7.2 Heat Transfer Reinforcement Structures
7.2.1 Directional Heat Conducting QDs-Polymer
7.2.2 Thermally Conductive Composites Annular Fins
7.2.3 Packaging Structure Optimization for Temperature Reduction
7.3 3D-Interconnected Thermal Conduction of QDs
7.4 Chapter Summary
References
Chapter 8 Thermal Management in Downhole Devices
8.1 Experimental Analysis of Passive Thermal Management Systems
8.1.1 Experimental Setup
8.1.2 Experimental Results
8.1.3 Finite-element Analysis
8.2 Thermal Modeling for Downhole Devices
8.2.1 Thermal Modeling
8.2.2 Experimental Setup
8.2.3 Experimental and Simulated Results
8.3 Phase-Change Materials Design
8.3.1 Material Preparation
8.3.2 Characteristics and Thermal Performance
8.4 Distributed PCM-Based Thermal Management Systems
8.4.1 System Design
8.4.2 Simulated and Experimental Results
8.5 Thermal Optimization of High-Temperature Downhole Electronic Devices
8.5.1 Optimization Method
8.5.2 Experimental Setup
8.5.3 Thermal Optimization Results
8.6 Chapter Summary
References
Chapter 9 Liquid Cooling for High-Heat-Flux Electronic Devices
9.1 Double-Nozzle Spray Cooling for High-Power LEDs
9.1.1 Spray Cooling System
9.1.2 Data Analysis Method and Uncertainty Analysis
9.1.3 Simulations for Junction Temperature Evaluation
9.1.4 Characteristics of High-Power LEDs Module and Spray Droplets
9.1.5 Results and Discussion
9.1.5.1 Effect of Nozzle Configuration and Flow Rate
9.1.5.2 Effect of Nozzle-to-Surface Distance
9.1.5.3 Validation Study
9.1.5.4 Estimation of Junction Temperature
9.2 Direct Body Liquid Cooling
9.2.1 Calculation of Surface Heat Transfer Coefficient
9.2.2 Body Cooling Thermal Conductive Model
9.2.3 Experiment
9.2.4 Numerical Simulation
9.2.5 Performance of the Developed JIBC Device
9.3 Integrated Piezoelectric Pump Cooling
9.3.1 Design and Fabrication of JAICIPM
9.3.2 Numerical Simulation
9.3.3 Experiment
9.3.4 Results and Discussion
9.4 Microchannel Cooling for Uniform Chip Temperature Control
9.4.1 Bilayer Compact Thermal Model
9.4.2 Heat Transfer in the Solid Layer
9.4.3 Heat Transfer in the Convection Layer
9.4.4 Heat Flux Iteration
9.4.5 Genetic Algorithm Optimization
9.4.6 Validation
9.5 Chapter Summary
References
Index
EULA