Thermal-fluid flow in parallel boards with heat generating blocks

✍ Scribed by Takahiro Furukawa; Wen-Jei Yang

• Book ID: 104135943
• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 655 KB
• Volume: 46
• Category: Article
• ISSN: 0017-9310
• DOI: 10.1016/s0017-9310(03)00357-0

✦ Synopsis

A method is developed to numerically investigate thermal-fluid flow behavior in a bundle of parallel boards with heat producing blocks. The system simulates cooling passages in a stack of electronic circuit boards with heat generating chips. At a low Reynolds number flow, a developing flow may achieve a fully developed flow state at certain block number from the entrance. Thermal conductivity of the board and thermal contact resistance between the chip and board has a considerable impact on thermal performance. The fluid flow and heat transfer performance in this channel flow is similar to that in ribbed channel flow.