✦ LIBER ✦
Thermal fatigue-resistant EMCs (Epoxy Molding Compounds) for microelectronic encapsulation
✍ Scribed by Jong-Woo Bae; Wonho Kim; Suk-Hyeon Cho; Yong-Woo Hong; Jung-Eun Shin; Sang-Hyun Lee
- Book ID
- 105608802
- Publisher
- Springer US
- Year
- 2000
- Tongue
- English
- Weight
- 736 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0256-1115
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