✦ LIBER ✦
Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique
✍ Scribed by A. Nyilas; R. Rehme; C. Wyrwich; H. Springer; G. Hinrichsen
- Publisher
- Springer
- Year
- 1996
- Tongue
- English
- Weight
- 253 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0261-8028
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