Thermal design problems with high speed ICs—Part 2 : R. J. Housman, Microelectronics1, No. 1, Autumn (1970), p. 45

• Book ID: 103273320
• Publisher: Elsevier Science
• Year: 1971
• Tongue: English
• Weight: 113 KB
• Volume: 10
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(71)90524-5