Thermal design and packaging of hybrid integrated circuits : V. T. Guntlow, D. P. Burks and J. H. Martin, Electron. Compon., September (1969), p. 1045

• Publisher: Elsevier Science
• Year: 1970
• Tongue: English
• Weight: 105 KB
• Volume: 9
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(70)90484-1