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Thermal contact conductance estimation and experimental validation in hot stamping process

โœ Scribed by Chao Wang, YiSheng Zhang, XiaoWei Tian, Bin Zhu, Jian Li


Book ID
113083117
Publisher
SP Science China Press
Year
2012
Tongue
English
Weight
555 KB
Volume
55
Category
Article
ISSN
1006-9321

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