✦ LIBER ✦
Thermal considerations for hybrid microcircuit packages and assemblies with high power dissipations : R. C. Chu, Proc. Tech. Programme, Int. Elect. Packaging Prod. Conf., Brighton, October 8–10 (1968), p. 411
- Publisher
- Elsevier Science
- Year
- 1969
- Tongue
- English
- Weight
- 101 KB
- Volume
- 8
- Category
- Article
- ISSN
- 0026-2714
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