Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T g behavior of the epoxy phas
Thermal conductivity studies on the curing process of diol-modified epoxy systems
✍ Scribed by A. Licea-Claveríe; K.-G. Häusler; K.-F. Arndt
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 218 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0032-3861
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