Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores: Numerical study and experimental validation

✍ Scribed by Ke Chu; Chengchang Jia; Wenhuai Tian; Xuebing Liang; Hui Chen; Hong Guo

• Book ID: 116378731
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 757 KB
• Volume: 41
• Category: Article
• ISSN: 1359-835X
• DOI: 10.1016/j.compositesa.2009.10.001