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Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies

✍ Scribed by Yuwang Han; Sumin Lv; Chanxi Hao; Fei Ding; Yi Zhang

Book ID: 113925185
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 783 KB
Volume: 529
Category: Article
ISSN: 0040-6031
DOI: 10.1016/j.tca.2011.11.029

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