The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university
Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling
β Scribed by Gordon N. Ellison
- Publisher
- CRC Press
- Year
- 2010
- Tongue
- English
- Leaves
- 418
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Synopsis
A total revision of the authorβs previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors.
The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book:
- Provides complete mathematical derivations and supplements formulae with design plots
- Offers complete exercise solutions (Mathcadβ’ worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book
- Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction
- Presents mathematical descriptions of large thermal network problem formulation
- Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems
This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
β¦ Table of Contents
Front Cover
Title Page
Β© 2011 by Taylor and Francis Group, LLC
Contents
Preface
About the Author
1 Introduction
2 Thermodynamics of Airflow
3 Airflow I: Forced Flow in Systems
4 Airflow II: Forced Flow in Ducts, Extrusions, and Pin Fin Arrays
5 Airflow III: Buoyancy Driven Draft
6 Forced Convective Heat Transfer I: Components
7 Forced Convective Heat Transfer II: Ducts, Extrusions, and Pin Fin Arrays
8 Natural Convection Heat Transfer I: Plates
9 Natural Convection Heat Transfer II: Heat Sinks
10 Thermal Radiation Heat Transfer
11 Conduction I: Basics
12 Conduction II: Spreading Resistance
13 Additional Mathematical Methods
APPENDIX i Supplemental Exercises
APPENDIX ii Physical Properties of Dry Air at Atmospheric Pressure
APPENDIX iii Radiation Emissivity at Room Temperature Assembled from Numerous Sources
APPENDIX iv Solution Details for U-Channel Radiation Network Equations
APPENDIX v Thermal Conductivity of Some Common Electronic Packaging Materials at Room Temperature: Values Are From Several Miscellaneous Sources
APPENDIX vi Some Properties of Bessel Functions
APPENDIX vii Some Properties of the Dirac Delta Function
APPENDIX viii Fourier Coefficients for a Rectangular Source
APPENDIX ix Derivation of the Greenβs Function Properties for the Spreading Problem of a Rectangular Source and Substrate - Method A
APPENDIX x Derivation of the Greenβs Function Properties for the Spreading Problem of a Rectangular Source and Substrate - Method B
APPENDIX xi Proof of the Steady-State Greenβs Function Reciprocity
APPENDIX xii Nonspreading Problems - Unequal Ambients
APPENDIX xiii Finned Surface to Flat Plate h Conversion
APPENDIX xiv Extending the Single-Source Problem to Multiple Sources and Resistances
APPENDIX xv Some Conversion Factors
Bibliography
Index
π SIMILAR VOLUMES
<p>The first edition of <strong>Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling </strong>was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included t
Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theo
<p>The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact c