✦ LIBER ✦
Thermal compression wafer bonding of tungsten applied to fabrication of small-period tungsten woodpile structures
✍ Scribed by Y. Zhou; S. Sridhar; K.C. Mishra; D. Klotzkin
- Book ID
- 113793515
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 436 KB
- Volume
- 64
- Category
- Article
- ISSN
- 0167-577X
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