✦ LIBER ✦
Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven : H. A. Lord. IEEE Trans. Semiconductor Mfg 1, 3, 105 (1988)
- Book ID
- 103285695
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 127 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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