Thermal and radiation chemical stabilities of some polymers after Cu(II) build-up

✍ Scribed by Siyam, T; Ashour, A H; Youssef, H A

• Publisher: John Wiley and Sons
• Year: 1999
• Tongue: English
• Weight: 122 KB
• Volume: 48
• Category: Article
• ISSN: 0959-8103
• DOI: 10.1002/(sici)1097-0126(199909)48:9<799::aid-pi157>3.0.co;2-j

✦ Synopsis

The interaction of polyacrylic acid (PAA), polysodium acrylate (PAANa), polyacrylamide (PAM) and acrylic acid±acrylamide copolymer P(AM-AA) with copper sulphate was studied to evaluate the thermal and radiation chemical stabilities of the resultant polymers which contained increasing quantities of Cu 2 . It was found that the ef®ciency of the polymers toward Cu 2 interaction, as determined by XRF, follows the order P(AM-AA) b PAM b PAANa. PAA was inactive, and no Cu 2 ions were detected. Generally, the results obtained from TGA and DSC reveal that there is an improvement in the thermal stability when Cu 2 is incorporated into the polymer matrix, but the amount of Cu 2 bound to the polymeric chains does not correlate with their relative thermal stability. The degree of crystallinity estimated by X-ray diffraction also increases as Cu 2 is incorporated into the polymer. In addition to the thermal stability, the radiation chemical stability of polymer with accumulated Cu 2 was found to be very high, so that the percentage of Cu 2 released from the crosslinked polymers was zero at radiation doses of up to 500 kGy.