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Thermal analysis of thermosetting phenolic compounds for injection molding

✍ Scribed by A. Siegmann; M. Narkis

Publisher: John Wiley and Sons
Year: 1977
Tongue: English
Weight: 416 KB
Volume: 21
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1977.070210903

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