✦ LIBER ✦
Thermal analysis of novel underfill materials with optimum processing characteristics
✍ Scribed by Yang Liu; Yi-Feng Wang; Timofey G. Gerasimov; Kenneth H. Heffner; Julie P. Harmon
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 221 KB
- Volume
- 98
- Category
- Article
- ISSN
- 0021-8995
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