✦ LIBER ✦
Theoretical analysis on extrusion die flow of electronic packaging materials
✍ Scribed by Jing-Pin Pan; Ta-Jo Liu; Ping-Yao Wu
- Publisher
- American Institute of Chemical Engineers
- Year
- 1999
- Tongue
- English
- Weight
- 105 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0001-1541
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