The yield-stress temperature relation for iron at low temperature
โ Scribed by J.S. Erickson; J.R. Low Jr.
- Publisher
- Elsevier Science
- Year
- 1957
- Weight
- 234 KB
- Volume
- 5
- Category
- Article
- ISSN
- 0001-6160
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โฆ Synopsis
The ratio of the "activation energies" for grainboundary and lattice-diffusion processes is approximately constant for substitutional diffusion in facecentered cubic metals, e.g. the ratio for the selfdiffusion of silver is 0.44. Qn, the "activation energy"
for the diffusional process controlling the growth, is estimated as 11.0 kcal/g-atom.
๐ SIMILAR VOLUMES
The temperature dependence of the yield stress in iron\* Erickson and Lo@' have recently suggested that the observed fattening of the yield-stress vs. temperature curve for iron at low temperatures may be due to the occmrence of tying rather than to the effect of s&mq&ere dew&y which is taken into