Electronic devices for automotive electronic applications have to be operated under extreme en~,ironmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic ones using thick film technology. This paper presents results that shows that our flip chip IC technology can satisfy the high reliability requirements of automobile electronics.
Chip resistors gain support RODERIC BERES FORD
Electronics 90 (17 Nov 1981) US companies gear up to make the small, light thick film devices, as a second domestic maker introduces an automatic insertion system.
Gallium arsenide digital Integrated circuits for appfications above one gigahertz M. ROCtll and M. GAVANT Acta electron. 23 (3), 243 (1980) (in French) Gallium arsenide logic approaches are compared about their static and dynamic performances. Their respective range of applications are then clearly defined. Frequency dividers by 2 to be used as test circuits for a high speed technology are thoroughly analysed. The design, optimisation and experimental evaluation of 2 diodes-B FL (Buffered FET logic) frequency dividers by 2 and 8 are then presented.