✦ LIBER ✦
The ultrasonic welding mechanism as applied to aluminum- and gold-wire bonding in microelectronics : George G. Harman and John Albers. IEEE Trans. Parts, Hybrids, Packaging PHP-13, (4) 406 (December 1977)
- Book ID
- 103276682
- Publisher
- Elsevier Science
- Year
- 1978
- Tongue
- English
- Weight
- 124 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0026-2714
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