✦ LIBER ✦
The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
✍ Scribed by H. Gaul; A. Shah; M. Mayer; Y. Zhou; M. Schneider-Ramelow; H. Reichl
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 683 KB
- Volume
- 87
- Category
- Article
- ISSN
- 0167-9317
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