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The three-dimensional analysis for diffusive shrinkage of a grain-boundary void in stressed solid

โœ Scribed by Hua Wang; Zhonghua Li

Book ID
111590361
Publisher
Springer
Year
2004
Tongue
English
Weight
248 KB
Volume
39
Category
Article
ISSN
0022-2461

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AbstractรDiusion induced grain boundary migration (DIGM) in the Cu(Zn) system was experimentally studied by Li and Hillert using polycrystalline Cu specimens zinciยฎed with binary CuยฑZn alloys containing 3.9ยฑ30.5 wt% of Zn at temperatures between 573 and 773 K. Their experimental results have been qu