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The thermal step technique: an advanced method for studying the properties and testing the quality of polymers

✍ Scribed by Toureille, A.; Notingher, P.; Vella, N.; Malrieu, S.; Castellon, J.; Agnel, S.


Publisher
John Wiley and Sons
Year
1998
Tongue
English
Weight
528 KB
Volume
46
Category
Article
ISSN
0959-8103

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✦ Synopsis


It is well known that the physical properties of a polymer alter with time. This phenomenonÈageingÈis strongly related to the external factors acting upon the polymer and to the manufacturing process. An appropriate process could prevent the premature and undesired changes in the characteristics of a polymeric material. For this reason, considerable e †orts are made to understand the mechanism of polymer degradation.

Past studies have shown that the existence of electrical charges in the bulk of polymers can a †ect their properties signiÐcantly. These chargesÈusually called space charges or space chargeÈwere Ðrst observed in polymers used for electrical insulation and therefore submitted to high electric Ðelds.

Some recent studies, particularly those presented in this paper, proved that space charge exists in almost every polymer. It has been shown that space charge can be present within the material from the very manufacturing process, without previous submission to stress. The increase of the amount of the space charge seems strongly related to the deterioration of the physical properties of polymers. Space charge measurements can therefore be considered as a test of quality for polymers.

This paper is dedicated to a method for measuring space charge : the Thermal Step Method (TSM). The physical basis of the technique, as well as its applications, are presented. Results obtained on various polymers are presented and discussed. The results show that the features of this technique, particularly its high sensitivity, make it an appropriate tool for the characterization of a wide variety of materials. The TSM could also be associated with other physical, chemical or physico-chemical techniques.

1998 SCI.


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