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The thermal evaluation of the substrate mixed with microencapsulated phase change materials for MEMS packaging applications

โœ Scribed by Wei-Tzuo Lin; De-Shau Huang; Ming-Tzer Lin; Chi-Ming Lai

Book ID
106186010
Publisher
Springer-Verlag
Year
2010
Tongue
English
Weight
536 KB
Volume
17
Category
Article
ISSN
0946-7076

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โœ Yufeng Peng; Jinling Cui; Zuhai Cheng; Duluo Zuo; Yaoning Zhang ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 280 KB

Under irradiating of the laser power of 2 kW, the thermal deformations of the silicon mirror substrates with phase change materials are experimentally measured and numerically analyzed by using finite element methods, respectively. The experimental results show that when the absorbed laser power is