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The thermal degradation of an amine-cured epoxide resin at temperatures between 200°C. and 310°C.

✍ Scribed by J. C. Patterson-Jones; D. A. Smith


Publisher
John Wiley and Sons
Year
1968
Tongue
English
Weight
986 KB
Volume
12
Category
Article
ISSN
0021-8995

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✦ Synopsis


This paper describes the nonoxidative thermal degradation of an epoxide resin based on the diglycidyl ether of bisphenol A crosslinked with p,p'diaminodiphenyl methane. Temperatures of degradation lay between 200 and 310°C. and the process was followed concurrently by three means: changes in dielectric properties, changes in infrared spectra, and weight loss. Dielectric properties support the contention that there is a dehydration step during degradation. It is proposed that vacuum curing a t high temperature can produce optimum crosslinking. Evidence of phenol and N-methyl aniline as degradation products is advanced, and possible degradation mechanisms are d i s cussed.


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## Abstract The thermal degradations of 1‐(N‐ethylanilino)‐3‐phenoxypropan‐2‐ol in an inert atmosphere, in air, and over alumina were studied with the aim of investigating the thermal stability of the cure linkage in aromatic amine‐cured bisphenol A‐based epoxide resins. Degradation products were c