The effect of crosslinking on thermal an
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Huey-Chiang Liou; Paul S. Ho; Andrew McKerrow
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Article
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1998
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John Wiley and Sons
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English
โ 243 KB
๐ 2 views
As the minimum features in semiconductor devices decrease, it is a new trend to incorporate copper and polymers with dielectric constant less than 3.0 to enhance the performance of the devices. Two fluorinated polymers, poly(biphenyl perfluorocyclobutyl ether) (BPFCB) and poly(1,1,1-triphenyl ethane