The segregation of copper at high angle grain boundaries in lead
โ Scribed by H Gleiter
- Publisher
- Elsevier Science
- Year
- 1970
- Weight
- 812 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0001-6160
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
A high-angle grain boundary is modeled as a planar defect characterized by its thickness and atomic density. We successively examine the elastic and electronic contributions to the solute/grain boundary binding energy. We deduce the effect of the grain boundary physical parameters on its propensity
A coincidence model of high-angle grain boundaries can be extended to include deviations from coincidence. The generalised boundary has a terraced structure, corresponding to the densely packed planes in the coincidence lattice, and a superimposed dislocation network, corresponding to a sub-boundary
The distribution of segregation levels of bismuth to grain boundaries in copper has been measured and compared using Auger electron spectroscopy (AES) and X-ray energy-dispersive spectroscopy (XEDS) in a scanning transmission electron microscope (STEM). The STEM-XEDS measurements showed that there a
We introduce a model for high-angle grain boundaries in the form of a two-dimensional array of compressive forces. Segregation profiles driven by the stress field around the boundary are calculated for several levels of translational order. We find an enhancement of segregation with increasing degre