Role of oxidizer in the chemical mechani
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V.S Chathapuram; T Du; K.B Sundaram; V Desai
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Article
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2003
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Elsevier Science
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English
β 452 KB
The electrochemical parameters controlling the polishing rates of Ti and TiN are investigated. In this paper, alumina containing slurry was studied at pH 4 with 5% H O as the oxidizer. Passive film formation on the 2 2 surface during chemical mechanical polishing (CMP) plays an important role. To un