The relationship between moisture resistance and epoxy molding compounds in integrated circuits

✍ Scribed by Osamu Nakagawa; Ikuo Sasaki; Hideo Hamamura; Toshinobu Banjo

• Book ID: 112815576
• Publisher: Springer US
• Year: 1984
• Tongue: English
• Weight: 545 KB
• Volume: 13
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/bf02656677