The process modelling of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals

✍ Scribed by C.K.W. Ip; C.K. Kwong; H. Bai; Y.C. Tsim

• Book ID: 105850360
• Publisher: Springer
• Year: 2003
• Tongue: English
• Weight: 288 KB
• Volume: 22
• Category: Article
• ISSN: 0268-3768
• DOI: 10.1007/s00170-002-1517-6