Compression creep of 63Sn37Pb solder bal
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Ning Zhang; Fuqian Yang; Yaowu Shi; Fu Guo
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Article
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2011
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Elsevier Science
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English
โ 787 KB
Using a constant load compression test, the creep deformation of 63Sn37Pb solder balls was studied in the load range 0.5-2 N and in the temperature range 25-150 ยฐC. There was no steady-state creep due to continuous changes in the contact area, which resulted in a decrease in the contact stress. Assu