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The oxidation of 63Sn/37Pb at typical soldering temperatures

โœ Scribed by R. G. Miller; C. Q. Bowles


Book ID
104873558
Publisher
Springer-Verlag
Year
1990
Tongue
English
Weight
638 KB
Volume
33
Category
Article
ISSN
0030-770X

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Compression creep of 63Sn37Pb solder bal
โœ Ning Zhang; Fuqian Yang; Yaowu Shi; Fu Guo ๐Ÿ“‚ Article ๐Ÿ“… 2011 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 787 KB

Using a constant load compression test, the creep deformation of 63Sn37Pb solder balls was studied in the load range 0.5-2 N and in the temperature range 25-150 ยฐC. There was no steady-state creep due to continuous changes in the contact area, which resulted in a decrease in the contact stress. Assu