The nanomachining future

• Book ID: 104367126
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 112 KB
• Volume: 17
• Category: Article
• ISSN: 0961-1290
• DOI: 10.1016/s0961-1290(04)00442-9

✦ Synopsis

Getting the lead out

Two new Thermocomp GR composites from LNP Engineering Plastics, (GE Advanced Materials) are formulated to endure thermal demands of lead-free soldering, as in IR reflow soldering. A new grade, HT Solder UF-1006, is based on polyphthalamide (PPA). The HT Solder ZF-1006, employs a matrix of modified PPE). Both have 30% glass filling, offer heat distortion temperatures in excess of 260 o C, a halogen-free, eco-compliant, flame retard package. Mould shrinkage values are similar to polyester materials.