The kinetics of thermal degradation and the structure of bisphenol-A epoxy binder modified by active plasticizer
β Scribed by N. N. Volkova; V. P. Tarasov; L. N. Erofeev; Yu. A. Gorbatkina
- Book ID
- 111468980
- Publisher
- SP MAIK Nauka/Interperiodica
- Year
- 2006
- Tongue
- English
- Weight
- 160 KB
- Volume
- 48
- Category
- Article
- ISSN
- 1560-0904
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Curing kinetics and thermal degradation of phosphate-modified thiodiphenol-containing epoxy copolymer (P3-ETP) were conducted. The kinetic study reveals that P3-ETP resin has better curing properties than unmodified epoxy resin (ETP). The activation energy, in kJ/mol, was 61.5 for P3-ETP, 89.1 for E
The effect of thermal degradation on the mechanical properties of a diglycidyl ether of bisphenol A (DGEBA)/1,3-bisaminomethylcyclohexane (1,3-BAC) epoxy system, cured with two different curing cycles-a short cycle and a long cycle-were studied using tensile and Izod impact experiments and scanning