✦ LIBER ✦
The intertool profile interchange format: an object-oriented approach [semiconductor technology CAD/CAM]
✍ Scribed by Boning, D.S.; Heytens, M.L.; Wong, A.S.
- Book ID
- 111858171
- Publisher
- IEEE
- Year
- 1991
- Tongue
- English
- Weight
- 849 KB
- Volume
- 10
- Category
- Article
- ISSN
- 0278-0070
- DOI
- 10.1109/43.85761
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