The influence on the distribution of interfacial stresses of embedded inclusions and voids in the adherends of bimaterial structures

✍ Scribed by Jiong-Shiun Hsu; Wei-Chung Wang

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 460 KB
• Volume: 36
• Category: Article
• ISSN: 0263-2241
• DOI: 10.1016/j.measurement.2004.04.001

✦ Synopsis

In this paper, the digital photoelastic technique and finite element method (FEM) were combined to investigate the influence of embedded inclusions and voids on the distribution of interfacial stresses of bimaterial structures. A special casting procedure was employed to manufacture the bimaterial structures with and without voids and inclusions in the adherends. As indicated from the results of this paper, after introducing inclusions or voids in the adherends, the interfacial peeling stresses may become most critical.